JPH0317648U - - Google Patents

Info

Publication number
JPH0317648U
JPH0317648U JP7846789U JP7846789U JPH0317648U JP H0317648 U JPH0317648 U JP H0317648U JP 7846789 U JP7846789 U JP 7846789U JP 7846789 U JP7846789 U JP 7846789U JP H0317648 U JPH0317648 U JP H0317648U
Authority
JP
Japan
Prior art keywords
chip
lead frame
protrusion
approximately
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7846789U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7846789U priority Critical patent/JPH0317648U/ja
Publication of JPH0317648U publication Critical patent/JPH0317648U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7846789U 1989-07-03 1989-07-03 Pending JPH0317648U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7846789U JPH0317648U (en]) 1989-07-03 1989-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7846789U JPH0317648U (en]) 1989-07-03 1989-07-03

Publications (1)

Publication Number Publication Date
JPH0317648U true JPH0317648U (en]) 1991-02-21

Family

ID=31621765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7846789U Pending JPH0317648U (en]) 1989-07-03 1989-07-03

Country Status (1)

Country Link
JP (1) JPH0317648U (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203274A (ja) * 2008-05-27 2008-09-04 Tacmina Corp 残留塩素計およびこれを用いた液体殺菌装置
KR101017869B1 (ko) * 2008-10-09 2011-03-04 오영선 배수지 또는 수조에서의 수질 대표값 측정 시스템

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203274A (ja) * 2008-05-27 2008-09-04 Tacmina Corp 残留塩素計およびこれを用いた液体殺菌装置
KR101017869B1 (ko) * 2008-10-09 2011-03-04 오영선 배수지 또는 수조에서의 수질 대표값 측정 시스템

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